Радиаторы

    制造商 Серия Упаковка Состояние продукта Тип Упаковка охлаждаемая Способ крепления Форма Длина Ширина Диаметр Высота ребра Рассеивание мощности при повышении температуры Тепловое сопротивление при принудительном потоке воздуха Тепловое сопротивление при естественном Материал Отделка 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    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Упаковка охлаждаемая Способ крепления Форма Длина Ширина Диаметр Высота ребра Рассеивание мощности при повышении температуры Тепловое сопротивление при принудительном потоке воздуха Тепловое сопротивление при естественном Материал Отделка материала
    SC1148

    SC1148

    ACTIVE COOLER

    Raspberry Pi

    775
    RFQ

    -

    - Box Active - - - - - - - - - - - - -
    7109DG

    7109DG

    TOP MOUNT HEATSINK .45" D2PAK

    Boyd Laconia, LLC

    5,401
    RFQ
    7109DG

    Таблицы данных

    - Bag Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Copper Tin
    BDN18-3CB/A01

    BDN18-3CB/A01

    HEATSINK CPU W/ADHESIVE 1.81"SQ

    CTS Thermal Management Products

    354
    RFQ
    BDN18-3CB/A01

    Таблицы данных

    BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.355" (9.02mm) - 3.50°C/W @ 400 LFM 10.80°C/W Aluminum Black Anodized
    901-19-2-12-2-B-0

    901-19-2-12-2-B-0

    HEATSINK 19X19X12MM PIN

    Wakefield-Vette

    2,598
    RFQ
    901-19-2-12-2-B-0

    Таблицы данных

    901 Box Active Top Mount BGA Push Pin Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.457" (11.60mm) - 6.60°C/W @ 200 LFM 12.70°C/W Aluminum Black Anodized
    APF19-19-06CB/A01

    APF19-19-06CB/A01

    HEATSINK FORGED W/ADHESIVE TAPE

    CTS Thermal Management Products

    839
    RFQ
    APF19-19-06CB/A01

    Таблицы данных

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.250" (6.35mm) - 7.10°C/W @ 200 LFM - Aluminum Black Anodized
    531002B02500G

    531002B02500G

    HEATSINK TO-220 W/PINS 1" TALL

    Boyd Laconia, LLC

    584
    RFQ
    531002B02500G

    Таблицы данных

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
    APF19-19-10CB/A01

    APF19-19-10CB/A01

    HEATSINK FORGED W/ADHESIVE TAPE

    CTS Thermal Management Products

    3,434
    RFQ
    APF19-19-10CB/A01

    Таблицы данных

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.370" (9.40mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-54270D-C1-R0

    ATS-54270D-C1-R0

    HEAT SINK 27MM X 27MM X 9.5MM

    Advanced Thermal Solutions Inc.

    2,391
    RFQ
    ATS-54270D-C1-R0

    Таблицы данных

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.374" (9.50mm) - 14.10°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-CPX060060006-205-C2-R0

    ATS-CPX060060006-205-C2-R0

    HEATSINK 60X60X6MM XCUT CP

    Advanced Thermal Solutions Inc.

    213
    RFQ
    ATS-CPX060060006-205-C2-R0

    Таблицы данных

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.236" (6.00mm) - 13.00°C/W @ 100 LFM - Aluminum Blue Anodized
    C40-058-AE

    C40-058-AE

    HEATSINK FOR TO-247 TO-264

    Ohmite

    1,168
    RFQ
    C40-058-AE

    Таблицы данных

    C40 Box Active Board Level, Vertical TO-247, TO-264, SOT-227 Clip and Board Mounts Rectangular, Fins 2.283" (58.00mm) 1.724" (43.79mm) - 1.260" (32.00mm) - - - Aluminum Black Anodized
    ATS-P1-138-C2-R0

    ATS-P1-138-C2-R0

    HEATSINK 25X25X15MM L-TAB T766

    Advanced Thermal Solutions Inc.

    965
    RFQ
    ATS-P1-138-C2-R0

    Таблицы данных

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.590" (15.00mm) - 12.18°C/W @ 100 LFM - Aluminum Blue Anodized
    BDN18-6CB/A01

    BDN18-6CB/A01

    HEATSINK CPU W/ADHESIVE 1.81"SQ

    CTS Thermal Management Products

    349
    RFQ
    BDN18-6CB/A01

    Таблицы данных

    BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.605" (15.37mm) - 2.80°C/W @ 400 LFM 8.10°C/W Aluminum Black Anodized
    ATS-TI1OP-521-C1-R1

    ATS-TI1OP-521-C1-R1

    HEAT SINK FOR TI MOD #TPA3130D

    Advanced Thermal Solutions Inc.

    9,137
    RFQ
    ATS-TI1OP-521-C1-R1

    Таблицы данных

    - Bulk Active Top Mount - Bolt On Rectangular, Fins 1.969" (50.00mm) 0.547" (13.89mm) - 0.984" (25.00mm) - 8.50°C/W @ 200 LFM - Aluminum Black Anodized
    593002B03400G

    593002B03400G

    HEATSINK TWISTED FIN TO-220

    Boyd Laconia, LLC

    7,169
    RFQ
    593002B03400G

    Таблицы данных

    Channel 5900 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 0.942" (23.93mm) - 0.500" (12.70mm) 1.0W @ 20°C 4.00°C/W @ 600 LFM 13.40°C/W Aluminum Black Anodized
    532702B02500G

    532702B02500G

    HEATSINK TO-220 SOLDERPIN 50.8MM

    Boyd Laconia, LLC

    484
    RFQ
    532702B02500G

    Таблицы данных

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) 10.0W @ 50°C 2.00°C/W @ 300 LFM 4.80°C/W Aluminum Black Anodized
    ATS-56001-C1-R0

    ATS-56001-C1-R0

    HEAT SINK 19MM X 19MM X 9MM

    Advanced Thermal Solutions Inc.

    2,924
    RFQ
    ATS-56001-C1-R0

    Таблицы данных

    maxiFLOW Bulk Active Top Mount ASIC Thermal Tape, Adhesive (Included) Square, Angled Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.354" (9.00mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
    APF30-30-13CB/A01

    APF30-30-13CB/A01

    HEATSINK FORGED W/ADHESIVE TAPE

    CTS Thermal Management Products

    403
    RFQ
    APF30-30-13CB/A01

    Таблицы данных

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.500" (12.70mm) - 2.50°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-54150D-C1-R0

    ATS-54150D-C1-R0

    HEAT SINK 15MM X 15MM X 9.5MM

    Advanced Thermal Solutions Inc.

    1,564
    RFQ
    ATS-54150D-C1-R0

    Таблицы данных

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.374" (9.50mm) - 26.20°C/W @ 200 LFM - Aluminum Black Anodized
    APF40-40-06CB/A01

    APF40-40-06CB/A01

    HEATSINK FORGED W/ADHESIVE TAPE

    CTS Thermal Management Products

    608
    RFQ
    APF40-40-06CB/A01

    Таблицы данных

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.250" (6.35mm) - 3.30°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-55170D-C1-R0

    ATS-55170D-C1-R0

    HEAT SINK 17MM X 17MM X 9.5MM

    Advanced Thermal Solutions Inc.

    2,059
    RFQ
    ATS-55170D-C1-R0

    Таблицы данных

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.374" (9.50mm) - 28.00°C/W @ 200 LFM - Aluminum Black Anodized
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