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| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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14-7068-0062SOLDER SOLID WIRE .062" 1LB SPL |
0 |
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Таблицы данных |
Solid Core Wire | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | - | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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JET551AX30T5JET PRINTING SOLDER PASTE SN63/P |
0 |
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Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | - | Leaded | Syringe, 3.53 oz (100g) | 12 Months | Date of Manufacture | - |
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4915-454GSOLDER LF SAC305 NO CLEAN |
0 |
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Таблицы данных |
4915 | Spool | Obsolete | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
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4916-454GSOLDER LF SAC305 NO CLEAN |
0 |
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Таблицы данных |
4916 | Spool | Obsolete | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.050" (1.27mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 16 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 65°F ~ 80°F (18°C ~ 27°C) |
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4925-454GSOLDER LF SAC305 RA FLUX |
0 |
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Таблицы данных |
4926 | Spool | Obsolete | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.032" (0.81mm) | 423 ~ 430°F (217 ~ 221°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
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4926-454GSOLDER LF SAC305 RA FLUX |
0 |
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Таблицы данных |
4926 | Spool | Obsolete | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 430°F (217 ~ 221°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) |
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92-6040-8860SOLDER FLUX-CORED/245 .025" 500G |
0 |
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Таблицы данных |
245 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.025" (0.64mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 30 AWG, 33 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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44-7150-0000SOLDER BAR E-BAR 1.66LB |
0 |
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Таблицы данных |
- | Bulk | Active | Bar Solder | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | - | - | - | Leaded | Bar, 1.66 lbs (750g) | - | - | - |
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14-7068-0125SOLDER SOLID WIRE .125" 1LB SPL |
0 |
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Таблицы данных |
Solid Core Wire | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.125" (3.18mm) | 423 ~ 424°F (217 ~ 218°C) | - | 8 AWG, 10 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7068-1411SOLDER FLUX-CORED/48 .093 1LB SP |
0 |
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Таблицы данных |
48 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.093" (2.36mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 11 AWG, 13 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7068-1405SOLDER FLUX-CORED/48 .0240" 1LB |
0 |
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Таблицы данных |
48 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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SMD291AX500T4CSOLDER PASTE 63/37 T4 500G |
0 |
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Таблицы данных |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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SMD4300AX500T4CSOLDER PASTE 63/37 T4 500G |
0 |
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Таблицы данных |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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24-7068-7632SOLDER FLUX-CORED/275 .093" 1LB |
0 |
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Таблицы данных |
275 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.093" (2.36mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 11 AWG, 13 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-0001-0027SOLDER FLUX-CORED/44 .031" 1LB S |
0 |
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Таблицы данных |
44 | Bulk | Active | Wire Solder | Sn95Sb5 (95/5) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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CQ-SS-SNBIAG-0.76MM-25000SOLDER SPHERES SN42/BI57.6/AG0.4 |
0 |
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Таблицы данных |
- | Bulk | Active | Solder Sphere | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.030" (0.76mm) | 280°F (138°C) | - | - | - | - | Jar | 24 Months | Date of Manufacture | - |
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24-7150-8809SOLDER FLUX-CORED/245 .025" 1LB |
0 |
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Таблицы данных |
245 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.025" (0.64mm) | 354°F (179°C) | No-Clean | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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SMD291AX250T6SOLDER PASTE IN JAR 250G (T6) SN |
0 |
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Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | - | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | - |
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24-7068-8846SOLDER FLUX-CORED/245 .0240" 1LB |
0 |
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Таблицы данных |
245 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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JET551SNL30T5JET PRINTING SOLDER PASTE SN96.5 |
0 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | - | Syringe, 3.53 oz (100g) | 12 Months | Date of Manufacture | - |
