БОМ
Припой
| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
RC96L2031EAG3SAC 305 ROSIN FLUX 8 OZ. .031 DI Canfield Technologies |
49 |
|
- |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CC96L2031ESAC 305 NO CLEAN FLUX 8 OZ .031 Canfield Technologies |
94 |
|
Таблицы данных |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WCBLF22701062BLF227 WATER SOLUBLE 1 LB. .062 Canfield Technologies |
49 |
|
- |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.062" (1.57mm) | 440°F (227°C) | Water Soluble | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WC96L2020PSAC 305 WATER SOLUBLE FLUX 8 OZ Canfield Technologies |
47 |
|
- |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CC96L2020ESACSAC305 NO CLEAN FLUX 8 OZ .020 D Canfield Technologies |
38 |
|
- |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WCBLF22701031BLF 227 WATER SOLUBLE FLUX 1 LB Canfield Technologies |
48 |
|
- |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.031" (0.79mm) | 440°F (227°C) | Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WCBLF22701020BLF 227 WATER SOLUBLE FLUX 1 LB. Canfield Technologies |
49 |
|
- |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.020" (0.51mm) | 440°F (227°C) | Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CCBLF22701020BLF 227 NO CLEAN FLUX 1 LB. .020 Canfield Technologies |
45 |
|
- |
- | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.020" (0.51mm) | 440°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CC9601062PSACSAC 305 NO CLEAN FLUX 1 LB .062 Canfield Technologies |
97 |
|
Таблицы данных |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
RC9601062PSACSAC 305 ROSIN FLUX 1 LB. 062 DIA Canfield Technologies |
48 |
|
- |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
