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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    111-43-632-41-001000

    111-43-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    170
    RFQ
    111-43-632-41-001000

    Таблицы данных

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-308-11-001000

    299-93-308-11-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    136
    RFQ
    299-93-308-11-001000

    Таблицы данных

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-320-31-012000

    614-93-320-31-012000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    381
    RFQ
    614-93-320-31-012000

    Таблицы данных

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-320-31-012000

    614-43-320-31-012000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    159
    RFQ
    614-43-320-31-012000

    Таблицы данных

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-320-SGG

    ICA-320-SGG

    CONN IC DIP SOCKET 20POS GOLD

    Samtec Inc.

    5
    RFQ
    ICA-320-SGG

    Таблицы данных

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-93-628-31-012000

    614-93-628-31-012000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    1,518
    RFQ
    614-93-628-31-012000

    Таблицы данных

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-950-41-001000

    110-43-950-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    207
    RFQ
    110-43-950-41-001000

    Таблицы данных

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-314-41-801000

    123-93-314-41-801000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    137
    RFQ
    123-93-314-41-801000

    Таблицы данных

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-324-41-801000

    110-43-324-41-801000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    209
    RFQ
    110-43-324-41-801000

    Таблицы данных

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-610-10-002000

    299-93-610-10-002000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    102
    RFQ
    299-93-610-10-002000

    Таблицы данных

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-43-121-41-005000

    317-43-121-41-005000

    CONN SOCKET 21POS .070 STR GOLD

    Mill-Max Manufacturing Corp.

    339
    RFQ
    317-43-121-41-005000

    Таблицы данных

    317 Tube Active SIP 21 (1 x 21) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-618-10-002000

    299-93-618-10-002000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    107
    RFQ
    299-93-618-10-002000

    Таблицы данных

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-632-S-O-TR

    ICF-632-S-O-TR

    CONN IC DIP SOCKET 32POS TIN

    Samtec Inc.

    271
    RFQ
    ICF-632-S-O-TR

    Таблицы данных

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    2319757-1

    2319757-1

    DUAL LGA,257 POS, DMD SOCKET

    TE Connectivity AMP Connectors

    1,140
    RFQ
    2319757-1

    Таблицы данных

    DMD Tray Active LGA 257 (20 x 30) 0.039" (1.00mm) Gold 3.00µin (0.076µm) Copper Alloy Surface Mount Board Guide, Open Frame Solder - - - - Thermoplastic -25°C ~ 100°C
    1-2324271-6

    1-2324271-6

    LEFT SEGMEN LGA4189-5 SOCKET-P5

    TE Connectivity AMP Connectors

    156
    RFQ
    1-2324271-6

    Таблицы данных

    - Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -25°C ~ 100°C
    1-2324271-5

    1-2324271-5

    RIGHT SEGMEN LGA4189-5 SOCKET-P5

    TE Connectivity AMP Connectors

    149
    RFQ
    1-2324271-5

    Таблицы данных

    - Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -25°C ~ 100°C
    2-2129710-7

    2-2129710-7

    CONN SOCKET LGA 3647POS GOLD

    TE Connectivity AMP Connectors

    222
    RFQ
    2-2129710-7

    Таблицы данных

    - Tray Active LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
    1-2324271-7

    1-2324271-7

    RIGHT SEGMEN LGA4189-5 SOCKET-P5

    TE Connectivity AMP Connectors

    33
    RFQ
    1-2324271-7

    Таблицы данных

    - Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
    1-2324271-8

    1-2324271-8

    LEFT SEGMEN LGA4189-5 SOCKET-P5

    TE Connectivity AMP Connectors

    33
    RFQ
    1-2324271-8

    Таблицы данных

    - Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
    2-2822979-4

    2-2822979-4

    CONN SOCKET LGA 3647POS GOLD

    TE Connectivity AMP Connectors

    84
    RFQ
    2-2822979-4

    Таблицы данных

    - Tray Active LGA 3647 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
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