Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
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04-1518-10TCONN IC DIP SOCKET 4POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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03-0513-10CONN SOCKET SIP 3POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
0513 | Bulk | Active | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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04-0518-10HCONN SOCKET SIP 4POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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04-1518-10HCONN IC DIP SOCKET 4POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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05-0518-10CONN SOCKET SIP 5POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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01-0503-20CONN SOCKET SIP 1POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
0503 | Bulk | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
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01-0503-30CONN SOCKET SIP 1POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
0503 | Bulk | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 30.0µin (0.76µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
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04-1518-00CONN IC DIP SOCKET 4POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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02-0518-11HCONN SOCKET SIP 2POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
02-1518-11HCONN IC DIP SOCKET 2POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |