| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Номинальный ток (Ампер) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TSM-106-02-L-DVCONN HEADER SMD 12POS 2.54MM Samtec Inc. |
154 |
|
Таблицы данных |
TSM | Tube | Active | Header, Cuttable | Male Pin | 0.100" (2.54mm) | 12 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.320" (8.13mm) | - | - | 0.100" (2.54mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | - |
|
TSW-109-15-G-DCONN HEADER VERT 18POS 2.54MM Samtec Inc. |
1,222 |
|
Таблицы данных |
TSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 18 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.520" (13.21mm) | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.100" (2.54mm) | Square | Gold | Gold | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | - |
|
TST-103-01-T-DCONN HEADER VERT 6POS 2.54MM Samtec Inc. |
410 |
|
Таблицы данных |
Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.250" (6.35mm) | 0.115" (2.92mm) | 0.480" (12.19mm) | 0.350" (8.89mm) | Square | Tin | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | 3.4A per Contact |
|
IPBT-103-H2-T-S-KCONN HEADER SMD 3POS 4.2MM Samtec Inc. |
0 |
|
Таблицы данных |
Power Mate® IPBT | Tube | Active | Header | Male Pin | 0.165" (4.20mm) | 3 | 1 | - | All | Board to Board or Cable | Shrouded - 4 Wall | Surface Mount | Solder | Locking Ramp | 0.260" (6.60mm) | - | - | 0.380" (9.65mm) | Square | Tin | Tin | Copper Alloy | Liquid Crystal Polymer (LCP) | - | - |
|
TMS-108-54-G-S.050" (1.27MM) MICRO HEADER Samtec Inc. |
314 |
|
Таблицы данных |
TMS | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 8 | 1 | - | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.335" (8.51mm) | 0.120" (3.05mm) | 0.555" (14.10mm) | 0.100" (2.54mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 5A per Contact |
|
FTS-107-01-F-DVCONN HEADER SMD 14POS 1.27MM Samtec Inc. |
13 |
|
Таблицы данных |
FTS | Bulk | Active | Header, Cuttable | Male Pin | 0.050" (1.27mm) | 14 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.034" (0.86mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3.4A per Contact |
|
TSM-105-03-S-DVCONN HEADER SMD 10POS 2.54MM Samtec Inc. |
510 |
|
Таблицы данных |
TSM | Tube | Active | Header, Cuttable | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.420" (10.67mm) | - | - | 0.100" (2.54mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | - |
|
TSM-108-01-F-DVCONN HEADER SMD 16POS 2.54MM Samtec Inc. |
132 |
|
Таблицы данных |
TSM | Tube | Active | Header, Cuttable | Male Pin | 0.100" (2.54mm) | 16 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.230" (5.84mm) | - | - | 0.100" (2.54mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | - |
|
TMM-105-01-G-D-SM-ACONN HEADER SMD 10POS 2MM Samtec Inc. |
563 |
|
Таблицы данных |
TMM | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 10 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.126" (3.20mm) | - | - | 0.059" (1.50mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide | 3.2A per Contact |
|
HPM-08-04-T-SCONN HEADER VERT 8POS 5.08MM Samtec Inc. |
19 |
|
Таблицы данных |
HPM | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 8 | 1 | - | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.830" (21.08mm) | 0.161" (4.09mm) | 1.091" (27.71mm) | 0.100" (2.54mm) | Square | Tin | Tin | Copper Alloy | Polybutylene Terephthalate (PBT) | - | - |